Thin film processing method and thin film processing apparatus including controlling the cooling rate to control the crystal sizes

ABSTRACT

A thin film processing method for processing the thin film by irradiating an optical beam to the thin film. A unit of the irradiation of the optical beam includes a first and a second optical pulse irradiation to the thin film, and the unit of the irradiation is carried out repeatedly to process the thin film. The first and the second optical pulse have pulse waveforms different from each other. Preferably, a unit of the irradiation of the optical beam includes the a first optical pulse irradiated to the thin film and a second optical pulse irradiated to the thin film starting substantially simultaneous with the first optical pulse irradiation. In this case, the relationship between the first and the second optical pulse satisfies (the pulse width of the first optical pulse)&lt;(the optical pulse of the second optical pulse) and (the irradiation intensity of the first optical pulse)≧(the irradiation intensity of the second optical pulse). A silicon thin film with a small trap state density can be formed by the optical irradiation.

BACKGROUND OF THE INVENTION

1. Field of the Invention

This invention relates to a system for the formation of a silicon thinfilm and a good-quality semiconductor-insulating film interface. Suchsilicon thin films are used for crystalline silicon thin filmtransistors, and such semiconductor-insulating film interfaces areemployed for field effect transistors. The invention also relates to asemiconductor thin film forming system by the pulsed laser exposuremethod. In addition, the invention relates to a system for themanufacture of driving elements or driving circuits composed of thesemiconductor thin films or field effect thin film transistors fordisplays and sensors, for example.

2. Description of the Related Art

Typical processes for the formation of a thin film transistor (TFT) on aglass substrate are a hydrogenated amorphous silicon TFT process and apolycrystalline silicon TFT process. In the former process, the maximumtemperature in a manufacture process is about 300° C., and the carriermobility is about 1 cm²/Vsec. Such a hydrogenated amorphous silicon TFTformed by the former process is used as a switching transistor of eachpixel in an active matrix (AM) liquid crystal display (LCD) and isdriven by a driver integrated circuit (IC, an LSI formed on a singlecrystal silicon substrate) arranged on the periphery of a screen. Eachof the pixels of this system includes an individual switching elementTFT, and this system can yield a better image quality with lesscrosstalk than a passive matrix LCD. In such a passive matrix LCD, anelectric signal for driving the liquid crystal is supplied from aperipheral driver circuit. In contrast, the latter polycrystallinesilicon TFT process can yield a carrier mobility of 30 to 100 cm²/Vsecby, for example, employing a quartz substrate and performing a processat high temperatures of about 1000° C. as in the manufacture of LSIs.For example, when this process is applied to a liquid crystal displaymanufacture, such a high carrier mobility can yield a peripheral drivercircuit on the same glass substrate concurrently with the formation ofpixel TFTs for driving individual pixels. This process is thereforeadvantageous to minimize manufacture process costs and to downsize theresulting products. If the product should be miniaturized and shouldhave a higher definition, a connection pitch between an AM-LCD substrateand a peripheral driver integrated circuit must be decreased. Aconventional tab connection method or wire bonding method cannotsignificantly provide such a decreased connection pitch. However, if aprocess at high temperatures as in the above case is employed in thepolycrystalline silicon TFT process, low softening point glasses cannotbe employed. Such low softening point glasses can be employed in thehydrogenated amorphous silicon TFT process and are available at lowcosts. The process temperature in the polycrystalline silicon TFTprocess should be therefore decreased, and techniques for the formationof polycrystalline silicon films at low temperatures have been developedby utilizing a laser-induced crystallization technique.

Such a laser-induced crystallization is generally performed by a pulselaser irradiator having a configuration shown in FIG. 15. A laser lightsupplied from a pulse laser source 1101 reaches a silicon thin film1107, a work, on a glass substrate 1108 via an optical path 1106. Theoptical path 1106 is specified by a group of optic devices includingmirrors 1102, 1103, and 1105, and a beam homogenizer 1104. The beamhomogenizer 1104 is arranged to uniformize spatial intensities of laserbeams. Generally, because the irradiation area is smaller than that ofthe glass substrate 1108, the glass substrate on an X-Y stage 1109 ismoved to irradiate an optional position on the substrate with a laserbeam. The laser irradiation can be also performed by moving the opticdevice group or moving the optic device group and the stage incombination. Laser irradiation may also be carried out in a vacuum or inthe high purity gas atmosphere within the vacuum chamber. Whennecessary, a cassette 1110 having the glass substrate with silicon thinfilm and a substrate carrier mechanism 1111 are provided formechanically separating and accommodating the substrate between thecassette and the stage.

Japanese Patent Publication (JP-B) No. 7-118443 discloses a technique ofirradiating an amorphous silicon thin film on an amorphous substratewith a short wavelength pulse laser light. This technique cancrystallize an amorphous silicon while keeping the overall substratefrom high temperatures, and can produce semiconductor elements orsemiconductor integrated circuits on large substrates available at lowcosts. Such large substrates are required in liquid crystal displays,and such substrate available at low costs may be glasses, for example.However, as is described in the above publication, the crystallizationof an amorphous silicon thin film by action of a short wavelength laserlight requires an irradiation intensity of about 50 to 500 mJ/cm².However, the maximum emission output of a conventionally available pulselaser irradiator is at most about 1 J/pulse, and an area to beirradiated by a single irradiation is at most about 2 to 20 cm², by asimple conversion. For example, if the overall of a 47 cm×37 cmsubstrate should be crystallized by action of laser, at least 87 to 870points of the substrate must be irradiated with a laser light. Likewise,the number of points to be irradiated with a laser light increases withan increasing size of the substrate, for example, as in a 1 m×1 msubstrate. Such a laser-induced crystallization is generally performedby a pulse laser irradiator having a configuration shown in FIG. 15.

To form uniform thin film semiconductor elements on a large substrate bythe above technique, an effective process is known as disclosed inJapanese Unexamined Patent Publication (JP-A) No. 5-211167 (JapanesePatent Application No. 3-315863). The process includes the steps ofdividing the elements to portions smaller than the beam size of thelaser and repeating a combination of irradiation with several pulses andmovement of the area to be irradiated by step-and-repeat drawing method.In the process, the lasing and the movement of a stage (i.e., themovement of a substrate or laser beam) are alternatively performed, asshown in FIG. 16(2). However, even according to this process, thevariation of lasing intensity exceeds ±5% to ±10% when the irradiationprocedure is repeated at a density of about 1 pulse per irradiatedportion to 20 pulses per irradiated portion using a currently availablepulse laser irradiator with a uniformity of lasing intensity of ±5% to±10% (in continuous lasing). The resulting polycrystalline silicon thinfilm and polycrystalline silicon thin film transistor cannot thereforehave satisfactorily uniform characteristics. Particularly, thegeneration of a strong or weak light caused by an unstable discharge atearly stages of lasing significantly invites such heterogeneouscharacteristics. This phenomena is called as spiking. As a possiblesolution to the spiking, a process of controlling an applied voltage ina subsequent lasing with reference to the results of integratedstrengths can be employed. However, according to this process, a weaklight is rather oscillated even though the formation of spiking isinhibited. Specifically, when irradiation periods and non-lasing periodsare alternated, the intensity of a first irradiated pulse in eachirradiation period is most unstable and is varied, as shown in FIG. 17.In addition, the history of irradiation intensity differs from point topoint to be irradiated. The resulting transistor element and thin filmintegrated circuit cannot have a significant uniformity in the substrateplane.

To avoid such a spiking, a process is known to start lasing prior to theinitiation of irradiation to an area for the formation of element, asshown in FIG. 16(2). However, this technique shown in FIG. 16(2) cannotbe applied to a process of intermittently repeating the lasing and themovement of stage. To avoid these problems, a process is proposed inJapanese Unexamined Patent Publication (JP-A) No. 5-90191. The processincludes the steps of allowing a pulse laser source to continuouslyoscillate and inhibiting irradiation of a substrate with the laser lightby an optic shielding system during the movement of the stage.Specifically, as shown in FIG. 16(3), a laser is continuously oscillatedat a predetermined frequency, and the movement of stage to a targetirradiation position is brought into synchronism with the shielding ofan optic path. By this configuration, a laser beam with a stableintensity can be applied to a target irradiation position. However,although this process can stably irradiate the substrate with a laserbeam, the process also yields increased excess lasing that does notserve to the formation of a polycrystalline silicon thin film. Theproductivity is decreased from the viewpoint of the life of an expensivelaser source and an excited gas, and the production efficiency of thepolycrystalline silicon thin film is deteriorated with respect to powerrequired for lasing. The production costs are therefore increased. Whena substrate to be exposed to laser is irradiated with an excessivelystrong light as compared with a target intensity, the substrate will bedamaged. Such an excessively strong light is induced by an irregularirradiation intensity. In LCDs and other imaging devices, a lightpassing through the substrate scatters in an area where the substrate isdamaged, and the quality of image is deteriorated.

A process is known for the laser irradiation. In this process, aplurality of pulses are applied while the irradiation of each pulse isretarded. This process is disclosed by Ryoichi Ishihara et al. in“Effects of light pulse duration on excimer laser crystallizationcharacteristics of silicon thin films”, Japanese Journal of AppliedPhysics, vol. 34, No. 4A, (1995), pp 1759 (hereinafter called asReference). According to this Reference, the crystallizationsolidification rate of a molten silicon in a laser recrystallizationprocess is 1 m/sec or more. To achieve a satisfactory growth ofcrystals, the solidification rate must be reduced. By applying a secondlaser pulse immediately after the completion of solidification, thesecond irradiation of laser pulse can yield a recrystallization processwith a lower solidification rate. In viewing a temperature change (atime-hysteresis curve) of silicon as shown in FIG. 18, the temperatureof silicon increases with the irradiation of laser energy, for example,as a pulse with an intensity shown in FIG. 19. When a starting materialis an amorphous silicon (a-Si), the temperature further increases afterthe melting point of a-Si, and when the supplied energy becomes lessthan the energy required for increasing the temperature, the materialbegins to undergo cooling. At the solidifying point of a crystalline Si,the solidification proceeds for a solidification time and thencompletes, and the material is cooled to an atmospheric temperature.Provided that the solidification of silicon proceeds in a thicknessdirection from an interface between silicon and the substrate, anaverage solidification rate is calculated according to the followingequation.Average solidification rate=(Thickness of silicon)/(Solidification time)

Specifically, if the thickness of silicon is constant, thesolidification time is effectively prolonged to reduce thesolidification rate. If the process maintains ideal conditions onthermal equilibrium, the solidification time can be prolonged byincreasing an ideally supplied energy, i.e., a laser irradiation energy.However, as pointed out in the above reference, such an increasedirradiation energy invites the resulting film to become amorphous ormicrocrystalline. In an actual melting and recrystallization process,the temperature does not change in an ideal manner as shown in FIG. 18,and the material undergoes overheating when heated and undergoessupercooling when cooled, and attains a stable condition. Particularly,when the cooling rate in cooling procedure is extremely large and thematerial undergoes an excessive supercooling, the material is notcrystallized at around its solidification point, and becomes anamorphous solid due to quenching and rapid solidification. Under someconditions, thin films are converted not into amorphous materials butinto microcrystals, as shown in the above-mentioned Reference.

Accordingly, an object of the invention is to provide a process forforming a semiconductor thin film with a lower trap state density bylight irradiation and to provide a process and system for applying theabove process to large substrates with a high reproducibility.

Another object of the invention is to provide a means for forming asatisfactory gate insulating film on the semiconductor thin film of goodquality and to provide a system for producing a field effect transistorhaving a satisfactory semiconductor-insulating film interface, i.e.,satisfactory properties.

SUMMARY OF THE INVENTION

(1) According to the present invention, there is provided a thin filmprocessing method for processing the thin film by irradiating theoptical beam to the thin film, wherein

one set of irradiation of the optical beam includes a first and a secondoptical pulse irradiated to the thin film, and

each of the first and the second optical pulse has different pulsewaveforms.

(2) According to the present invention, there is provided a thin filmprocessing method wherein

the one set of irradiation includes the first optical pulse irradiationto the thin film and the second optical pulse irradiation to the thinfilm which substantially starts simultaneously with the irradiation ofthe first pulse.

(3) According to the present invention, there is provided a thin filmprocessing method as described in (2), wherein

the relationship between the first and the second pulse satisfies

(the pulse width of the first optical pulse)<(the pulse width of thesecond optical pulse),

(the irradiation intensity of the first optical pulse)≧(the irradiationintensity of the second optical pulse).

(4) According to the present invention, there is provided a thin filmprocessing method as described in (1), wherein

the one set of irradiation includes the first optical pulse irradiationto the thin film and the second optical pulse irradiation to the thinfilm which substantially starts with a delay to the first optical pulseirradiation.

(5) According to the present invention, there is provided a thin filmprocessing method as described in (4), wherein

the relationship between the first and the second pulse satisfies

(the pulse width of the first optical pulse)<(the pulse width of thesecond optical pulse).

(6) According to the present invention, there is provided a thin filmprocessing method as described in (5), wherein

the relationship between the first and the second pulse satisfies

(the irradiation intensity of the first optical pulse)≧(the irradiationintensity of the second optical pulse).

(7) According to the present invention, there is provided an apparatusfor processing thin film by irradiating the optical pulse to the thinfilm, the thin film processing apparatus comprises

a first and a second pulse optical source for producing a first and asecond optical pulse, respectively, wherein the first and the secondoptical pulse has different pulse waveforms, and

the one set of irradiation of the optical beam includes the irradiationfor the first and the second optical pulse to the thin film, wherein theset of irradiation is carried out repeatedly.

(8) According to the present invention, there is provided a thin filmprocessing apparatus as described in (7), wherein

the one set of irradiation includes the first optical pulse irradiationto the thin film and the second optical pulse irradiation to the thinfilm which substantially starts simultaneously with the irradiation ofthe first pulse.

(9) According to the present invention, there is provided a thin filmprocessing apparatus as described in (8), wherein

the relationship between the first and the second pulse satisfies

(the pulse width of the first optical pulse)<(the pulse width of thesecond optical pulse),

(the irradiation intensity of the first optical pulse)≧(the irradiationintensity of the second optical pulse).

(10) According to the present invention, there is provided a thin filmprocessing apparatus as described in (7), wherein

the one set of irradiation includes the first optical pulse irradiationto the thin film and the second optical pulse irradiation to the thinfilm which substantially starts with a delay to the first optical pulseirradiation.

(11) According to the present invention, there is provided a thin filmprocessing method as described in (10), wherein

the relationship between the first and the second pulse satisfies

(the pulse width of the first optical pulse)<(the pulse width of thesecond optical pulse).

(12) According to the present invention, there is provided a thin filmprocessing apparatus as described in (11), wherein

the relationship between the first and the second pulse satisfies

(the irradiation intensity of the first optical pulse)≧(the irradiationintensity of the second optical pulse).

FIG. 11 shows the relationship of the maximum cooling rate (Coolingrate, K/sec) obtained by mathematical calculation with the thresholdirradiation intensity between crystallization and microcrystallization.In this case, a 75-nm silicon thin film is irradiated with an excimerlaser with a wavelength of 308 nm, and the threshold is obtained by ascanning electron microscopic (SEM) observation of the silicon thin filmafter laser irradiation. FIG. 19 shows an emission pulse shape of thelaser used in the experiment. This pulse shape exhibits a long emissiontime 5 times or more that of a rectangular pulse with a pulse width of21.4 nsec described in the relevant Reference. Even a single pulseirradiation with the pulse shape in question is therefore expected toreduce the solidification rate as described in the Reference. FIG. 12shows a calculated temperature-time curve of silicon in laserrecrystallization using the pulse shape in question. Specifically, FIG.12 shows the temperature change of a silicon thin film 75 nm thick on aSiO₂ substrate when an XeCl laser (having a wavelength of 308 nm) isapplied at an irradiation intensity of 450 mJ/cm². About 60 nsec intothe irradiation, a second emission peak nearly completes, and thetemperature attains the maximum and then turns to decrease. (In thisconnection, in the mathematical calculation, a melting-solidificationpoint of amorphous silicon is employed as the melting-solidificationpoint, and the behavior of the material round the solidification pointdiffers from that in actual case. Particularly when a crystallized filmis obtained, the crystallization completes at the solidification pointof the crystalline silicon.) The curve has a large gradient upon theinitiation of cooling, but has a very small gradient at about 100 nsec,i.e., at a third emission peak. At elapsed time of 120 nsec, the lightemission completely ceases, and the silicon is then solidified throughanother rapid cooling process. Generally, when a liquid is solidifiedthrough “quenching” which is greatly out of a thermal equilibriumprocess, a sufficiently long solidification time cannot be obtained toform a crystal structure, and the resulting solid is amorphous(non-crystal). The maximum cooling rate was estimated from atemperature-time curve of silicon as shown in FIG. 12. FIG. 11 shows theestimated maximum cooling rates after the completion of light emissionwith respect to individual irradiation intensities. The figure showsthat the cooling rate increases with an increasing irradiationintensity. Separately, the structure of the silicon thin film afterlaser irradiation was observed with a scanning electron microscope. As aresult, as shown in FIG. 13, the grain size once increased with anincreasing irradiation intensity, but microcrystallization was observedat a set irradiation intensity of about 470 mJ/cm². When the film wasirradiated with three laser pulses, the grain size markedly increasedeven at a set irradiation intensity of about 470 mJ/cm², while amicrocrystallized region partially remained (FIG. 13). This largeincrease of the grain size differs from the behavior of the grain sizein the one-pulse irradiation. In this connection, an actual irradiationintensity is 5% to 10% higher than the set level, typically in initialseveral pulses of excimer laser. The threshold intensity at whichmicrocrystallization occurs can be therefore estimated as about 500mJ/cm². Based on these results, the cooling rate at 500 mJ/cm² as shownin FIG. 11 is estimated, and microcrystallization is found to occur at acooling rate of about 1.6×10¹⁰° C./sec or more. When the film to beirradiated is an a-Si film, the microcrystallization occurs at anirradiation intensity of about 500 mJ/cm² or more. Likewise, when thefilm to be irradiated is a poly-Si film, the microcrystallization mayoccur at an irradiation intensity about 30 mJ/cm² higher than that inthe a-Si at the same cooling rate of about 1.6×10¹⁰° C./sec. Bycontrolling the cooling rate to 1.6×10¹⁰° C./sec or less, therefore, theresulting crystal can be kept from becoming microcrystalline oramorphous and can satisfactorily grow.

Next, the case where a delayed second laser light is irradiated with adelay relative to a first laser light. As is described above, a laserlight at a late light emission stage suppresses the increase of thecooling rate, and the cooling rate after the completion of lightemission controls the crystallization. The last supplied energy issupposed to initialize precedent cooling processes. Specifically, bysupplying an additional energy, a precedent cooling process is onceinitialized and a solidification process is repeated again, even if thecrystal becomes amorphous or microcrystalline in the precedent coolingprocess. This is provably because the interval of light irradiation isvery short of the order of nanoseconds, and loss of the energy bythermal conduction to the substrate and radiation to the atmosphere issmall. The energy previously supplied therefore remains nearly asintact. In this assumption, a long time interval sufficient to dissipateheat is not considered. Accordingly, by controlling the cooling rateafter the completion of a second heating by the additionally suppliedenergy, the crystal is expected to grow satisfactorily. As shown in FIG.14, the cooling rate is controlled to a desired level by controlling thedelay time of the second laser irradiation.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 shows an optical pulse waveform for use in describing theembodiment according to the present invention.

FIG. 2 is a diagram showing an embodiment (the overall configuration) ofthe invented exposure system.

FIG. 3 is a diagram showing an embodiment (aligning process) of theinvented exposure system.

FIG. 4 are diagrams showing an embodiment (mask projection process) ofthe invented exposure system.

FIG. 5 are diagrams showing embodiments (control procedures) of theinvented exposure system.

FIG. 6 is a side sectional view showing the invented exposure system,transfer chamber, and plasma-enhanced CVD chamber.

FIG. 7 is a top view of the invented composite system including, forexample, an exposure system, transfer chamber, and plasma-enhanced CVDchamber.

FIG. 8 shows sectional views showing the invented process for producingTFT.

FIG. 9 shows sectional views showing the invented process for producingTFT using alignment mark.

FIG. 10 shows sectional views showing the invented process for producingTFT including the formation of an alignment mark.

FIG. 11 is a diagram showing the relationship between the irradiationintensity and the cooling rate, and the cooling rate at which the filmbecomes amorphous.

FIG. 12 is an illustrative diagram of calculated temperature changes ofa silicon thin film.

FIG. 13 is a diagram showing crystal forms of silicon thin filmscorresponding to individual irradiation intensities.

FIG. 14 is a diagram showing the maximum cooling rate after the supplyof a second pulse, and the cooling rate around the solidification point.

FIG. 15 is a schematic view of a conventional excimer laser annealingapparatus.

FIG. 16 is a timing chart showing conventional and invented operationprocedures of laser annealing.

FIG. 17 is a diagram showing the pulse to pulse stability of laser pulseintensities.

FIG. 18 is a diagram showing an illustrative temperature change of asilicon film.

FIG. 19 is a diagram showing an illustrative laser pulse shape.

DESCRIPTION OF THE PREFERRED EMBODIMENT

The embodiments of the invention will now be illustrated in detail withreference to the drawings.

FIG. 1 illustrates an example of the embodiment of the presentinvention. Each of the oscillation start timings is depicted on theabscissa axis while the irradiation energy is depicted as the regionbound by the pulse line. FIG. 1( a) shows an example where a first pulselaser and a second pulse laser are oscillated at the simultaneoustiming. The time interval required between the supply of the triggersignal for controlling the oscillation and the actual start of theoscillation often depends upon the construction of the laser apparatus.Therefore, the “trigger oscillation” time is predetermined so that theirradiation can be simultaneously carried out. Since the emission timeof the second pulse is longer than that of the first pulse, thegradual-cooling effect becomes higher during the melting and solidifyingprocess. Moreover, during the melting process by the first pulse, withthe advantageous of the initial region processed by the second pulse,the larger area can be melted at once such that the processing speedwill become much faster.

FIG. 1( b) shows an example of the state in which the second pulse issupplied with a delay to the oscillation of the first pulse. The stateis much more preferable when the first pulse utilizes the optical sourcewith a small pulse width. In case where the melting and recrystallizingprocess is performed only by the first pulse, the gradual-cooling iscarried out because the amount of heat provided together with theincrease of the irradiation intensity increases. However, as shown inFIG. 11, when the maximam cooling rate increases within an extremelyshort time interval during the laser irradiation process and exceeds thecritical cooling rate, the solidifying process deviates the idealthermal equilibrium state. As a result, the microcrystalline oramorphous crystal are to be observed in the film thus obtained. Theabove-mentioned maximum cooling rate is observed immediately after thepeak of the irradiation pulse has been irradiated. At this stage, it ispossible to recover the melting state by supplying the additive energybefore the completion of the cooling process. By irradiating, as themeans to supply the additive energy, the pulse that has a long pulsewidth and a small peak intensity, it is possible to prevent thedeviation to the non-equilibrium state and to realize thegradual-cooling process. It is required to predetermine by theexperiment the delay time of the second pulse because it variesdepending on the intensity and the waveform of the first pulse. In thepresent embodiment, the preferable delay time is about 50–200 nsec.Since the pulse width used as the first pulse was about 120 nsec, underthe condition where the delay time exceeds 120 nsec, the second pulse iscontrolled to be irradiated after the completion of the emission of thefirst pulse as shown in FIG. 1( c).

FIG. 2 shows an embodiment of the invention. Pulsed ultraviolet (UV)beams are supplied from a first excimer laser EL1 and a second excimerlaser EL2 and are introduced via mirrors opt3 and otp3′ and lenses opt4to a homogenizer opt20′. The intensity profile of the beam is adjustedin the homogenizer so as to attain a target uniformity in a photo maskopt21, for example, an in-plane distribution of ±5%. (Original beamssupplied from the excimer lasers may have an intensity profile or totalenergy which varies pulse to pulse. The system therefore preferablyincludes a mechanism for adjusting the spatial intensity distributionand pulse-to-pulse intensity variation on the photo mask to achieve ahigher uniformity. The homogenizer generally includes a fly-eye lens ora cylindrical lens.) The patterned light formed by the photo mask isapplied via a reduction projection optical system opt23′ and a laserinlet window W0 onto a substrate sub0 placed in a vacuum chamber C0. Thesubstrate is mounted on a substrate stage S0, and a target region, forexample, a pattern transfer region ex0, can be exposed to the patternedlight by operating the substrate stage. In FIG. 2, the reductionprojecting optical system is illustrated, but the system can include a1:1 projecting optical system or an enlargement projecting opticalsystem. An optional region on the substrate is irradiated with thepatterned light by moving the substrate stage in X-Y direction in thefigure. The photo mask is mounted on a mask stage (not shown), and thebeam to be applied on the substrate can be controlled also by moving thephoto mask within a region capable of exposing.

To apply a target patterned light onto the substrate under desiredconditions, a mechanism is required. An illustrative mechanism will nowbe described. As an optical axis should be delicately and preciselyadjusted, in the following example, the optical axis is once adjustedand then fixed, and the position of the substrate is adjusted to controlthe irradiation. For adjusting the position of the irradiated surface ofthe substrate relative to the optical axis, the position of the surfacein a direction of the focus (Z direction) and the verticality relativeto the optical axis must be corrected. Of the θxy tilt correctiondirection, θxz tilt correction direction, θyz tilt correction direction,X exposure region moving direction, Y exposure region moving direction,and Z focusing direction in the figure, the verticality relative to theoptical axis is corrected by adjusting in the θxy tilt correctiondirection, θxz tilt correction direction, and θyz tilt correctiondirection. The position of the irradiated surface of the substrate iscontrolled to an appropriate position according to the focal depth ofthe optical system by adjusting the Z focusing direction.

FIG. 3 is an illustrative side sectional view of the adjustment andalignment mechanism of the substrate. The photo mask opt21, thereduction projection optical system opt23′, and the laser inlet windowW0 are arranged with respect to an exposure axis L0, as shown in thefigure. The substrate sub0 placed in a vacuum chamber C0 is mounted on aheater HO with a substrate adhesion mechanism, and asubstrate—XYZθxyθxzθyz—stage S0′. In this embodiment, a vacuum chamberis used, but an actual light irradiation should be preferably performedin an atmosphere of, for example, an inert gas, hydrogen gas, oxygengas, or nitrogen gas. The inside of the chamber is once evacuated and isthen replaced with the above-mentioned gas. The pressure in the chambermay be around atmospheric (barometric) pressure. By using a heater witha substrate adhesion mechanism, the substrate can be heated at atemperature of from room temperature to about 400° C. in lightirradiation procedure. When the inside pressure is set around barometricpressure, the substrate can be adhered to the heater through a vacuumchucking mechanism. Accordingly, the misalignment of the substrate canbe inhibited even if the substrate stage moves in the chamber, and thesupplied substrate can be surely fixed to the substrate stage even ifthe substrate has some warp or bending. In addition, the shift of thefocal depth due to heat-induced warp or bending can be minimized.

Laser interferometers i1 and i2 make alignment of the substrate and ameasurement of the position of the substrate in Z direction, via alength measuring window W-i and a length measuring mirror opt-i. Toalign the substrate, the position of an alignment mark on the substrateis determined with an off-axis microscope m0, a microscope light sourceLm, and a microscope element opt-m. A target exposure position can bedetermined using information about the substrate position obtained fromthe laser interferometer system. In FIG. 3, the off-axis alignment isillustrated, but the invented system can also employ through-the-lensalignment or through-the-mask (through-the-reticule) alignment. In themeasurement, measurement errors can be averaged by making measurementsfrom plural measuring points and determining a linear coordinate basedon the measured data through the least square method.

FIGS. 4(A) to 4(C) show the relationship between a mask pattern and analignment mark. The mask includes a mask (non-exposure area) mask1 and amask (exposure area) mask2. For example, when an excimer laser is usedas the light source, a film that absorbs and reflects ultravioletradiation is formed on a quartz substrate. The ultraviolet radiationpasses through such a quartz substrate. The film is formed from, forexample, aluminum, chromium, tungsten, or other metals, or is adielectric multilayer film, and is then patterned by photolithographyand etching processes to yield the mask. According to a target patternon the mask (indicated by the white areas in FIG. 4(A), a silicon filmis exposed to yield exposed Si portions (Si2) in a non-exposed Si (Si1)as shown in FIGS. 4(B) and 4(C). Where necessary, alignment andadjustment is conducted to make a mark on the mask mark1 agree with amark on the substrate mark2 prior to exposure. A predetermined anddesigned region on the silicon thin film can be therefore exposed. Inthe thin film transistor forming process using a silicon thin film, ifthe exposure process is a first process requiring the alignment (i.e.,no alignment mark is formed prior to the exposure process), an exposedmark mark3 should be preferably formed by exposure concurrently in theexposure process of the silicon thin film. By this procedure, analignment mark can be formed using an optical color difference betweena-Si and crystalline Si. By performing, for example, photolithography ina successive process with reference to the above alignment mark,transistors and other desired mechanisms and functions can be formed intarget regions which are exposed and modified. Subsequent to theexposure process, an Si oxide film is formed on the silicon thin filmand a target region of the silicon film is removed by etching. FIG. 4(C)show the state just mentioned above. A removed Si region (Si3) is aregion where the laminated silicon film and Si oxide film are removed byetching. In this configuration, Si oxide films (Si4 and Si5) arelaminated on the non-exposed Si (Si1) and the exposed Si (Si2). Byforming island structures including a silicon film covered with an oxidefilm as stated above, desired channel-source-drain regions of a thinfilm transistor or alignment marks necessary for successive processescan be formed. In such a transistor, elements are separated from oneanother.

FIGS. 5(1) and (2) are timing charts of essential control procedures. Inthe illustrative control procedure (1), the substrate is moved to atarget exposure position by operating the substrate stage. Next, theexposure position is accurately adjusted by focusing or alignmentoperation. In this procedure, the exposure position is adjusted toachieve a target predetermined accuracy of error of, for example, about0.1 μm to 100 μm. On completion of this operation, the substrate isirradiated with light. On completion of series of these operations, thesubstrate is moved to a successive exposure position. On completion ofirradiation of all the necessary regions on the substrate, the substrateis replaced with a new one, and the second substrate to be treated issubjected to a series of the predetermined operations. In the controlprocedure (2), the substrate is moved to a target exposure position byoperating the substrate stage. Next, the exposure position is accuratelyadjusted by focusing or alignment operation. In this procedure, theexposure position is adjusted to achieve a target predetermined accuracyof error of, for example, about 0.1 μm to 100 μm. On completion of thisoperation, the mask stage starts to operate. In the illustration, thesubstrate is irradiated with light after the initiation of the maskstage operation to avoid variation of moving steps during startup.Naturally, a region at a distance from the alignment position is to beexposed due to the movement of the stage, and an offset corresponding tothe shift must be previously considered. To avoid unstable operations,the light source may be operated prior to the light irradiation to thesubstrate, and the substrate may be irradiated with light by opening,for example, a shutter. Particularly, when an excimer laser is employedas the light source and lasing periods and suspension periods arerepeated in turn, several ten pulses emitted at early stages are knownto be particularly unstable. To avoid irradiation with these unstablelaser pulses, the beams can be intercepted according to the operation ofthe mask stage. On completion of irradiation of all the necessaryregions on the substrate, the substrate is replaced with a new one, andthe second substrate to be treated is subjected to a series of thepredetermined operations.

In this connection, an a-Si thin film 75 nm thick was scanned with a 1mm×50 μm beam at a 0.5-μm pitch in a minor axis direction. When thescanning (irradiation) was performed using one light source at a laserirradiation intensity of the irradiated surface of 470 mJ/cm², acontinuous single-crystal silicon thin film in the scanning directionwas obtained. In addition, a beam from a second light source was appliedwith a delay time of 100 nsec to yield a laser irradiation intensity ofthe irradiated surface of 150 mJ/cm², a continuous single-crystalsilicon thin film in the scanning direction was obtained, even at ascanning pitch of 1.0 μm. The trap state density in the crystallizedsilicon film was less than 10¹² cm^(−2.)

FIG. 6 is a side sectional view of an embodiment of the inventedsemiconductor thin film forming system. The system includes aplasma-enhanced CVD chamber C2, a laser irradiation chamber C5, and asubstrate transfer chamber C7. In the system, the substrate can betransferred via gate valves GV2 and GV5 without exposing to anatmosphere outside the system. The transfer can be performed in vacuo orin an atmosphere of an inert gas, nitrogen gas, hydrogen gas or oxygengas, in high vacuum, under reduced pressure or under pressure. In thelaser irradiation chamber, the substrate is placed on a substrate stageS5 with the aid of a chucking mechanism. The substrate stage S5 can beheated to about 400° C. In the plasma-enhanced CVD chamber, thesubstrate is placed on a substrate holder S2. The substrate holder S2can be heated to about 400° C. The figure illustrates the followingstate. A silicon thin film Si1 is formed on a glass substrate Sub0, andthe substrate is then brought into the laser irradiation chamber. Thesurface silicon thin film is modified into a crystalline silicon thinfilm Si2 by laser irradiation, and the substrate is then transferred tothe plasma-enhanced CVD chamber.

Laser beams are brought into the laser irradiation chamber in thefollowing manner. The laser beams are supplied from an excimer laser 1(EL1) and an excimer laser 2 (EL2), pass through a first beam line L1and a second beam line L2 and a laser composing optical system opt1, amirror opt11, a transmissive mirror opt12, a laser irradiation opticalsystem opt2, a homogenizer opt20, a photo mask opt21 mounted and fixedon a photo mask stage opt22, a projection optical system opt23, and alaser inlet window W1, and reach the substrate surface. In this figure,two excimer lasers are illustrated, but an optional number (one or more)of light sources can be employed in the system. The light source is notlimited to the excimer laser and includes, for example, carbon gaslaser, yttrium-aluminum-garnet (YAG) laser, and other pulse lasers. Inaddition, laser pulses can be made and applied onto the substrate byusing argon laser or another continuous wave (CW) light source and ahigh speed shutter.

In the plasma-enhanced CVD chamber, a radio frequency (RF) electrode D1and a plasma confinement electrode D3 constitute a plasma generatingregion D2 at a position at a distance from a region where the substrateis placed. For example, oxygen and helium are supplied to the plasmagenerating region, and a silane gas is supplied to the substrate using amaterial gas inlet system D4. By this configuration, a silicon oxidefilm can be formed on the substrate.

FIG. 7 is a top view of another embodiment of the invented semiconductorthin film forming system. A substrate transfer chamber C7 isrespectively connected to a load-unload chamber C1, a plasma-enhancedCVD chamber C2, a substrate heating chamber C3, a hydrogen plasmatreatment chamber C4, and a laser irradiation chamber C5 via gate valvesGV1 through GV6. Laser beams are supplied from a first beam line L1 anda second beam line L2 and are applied to the substrate surface via alaser composing optical system opt1, a laser irradiation optical systemopt2, and a laser inlet window W1. Gas supply systems gas1 to gas7, andventilators vent1 to vent7 are connected to the individual processchambers and the transfer chamber. By this configuration, desired gasspecies can be supplied, and target process pressures can be set. Inaddition, the ventilation and degree of vacuum can be controlled.Substrates sub2 and sub6 to be processed are placed horizontally asindicated by dotted lines in the figure.

FIG. 8 shows process flow charts showing an application of the inventedsemiconductor thin film forming system to a production process of thinfilm transistors. The process includes the following steps.

(a) A glass substrate sub0 is cleaned to remove organic substance,metals, fine particles and other impurities. Onto the cleaned glasssubstrate, a substrate covering film T1 and a silicon thin film T2 aresequentially formed. As the substrate covering film, a silicon oxidefilm is formed to a thickness of 1 μm by low pressure vapor deposition(LPCVD) process at 450° C. with silane and oxygen gases as materials. Byusing the LPCVD process, the overall exterior surface of the substratecan be covered with a film, except for a region where the substrate isheld (this embodiment is not shown in the figure). Alternatively, theprocess can employ, for example, a plasma-enhanced CVD process usingtetraethoxysilane (TEOS) and oxygen as materials, a normal pressure CVDprocess using TEOS and ozone as materials, or the plasma-enhanced CVDprocess shown in FIG. 17. An effective substrate covering film includessuch a material as to prevent the diffusion of impurities in thesubstrate material. Such impurities adversely affect semiconductorelements. The substrate may comprise, for example, a glass having aminimized alkali metal concentration or a quartz or glass having apolished surface. The silicon thin film is formed to a thickness of 75nm by LPCVD at 500° C. with a disilane gas as a material. Under theseconditions, the resulting film is to have a hydrogen atom concentrationof 1 atomic percent or less, and the film can be prevented from, forexample, roughening due to emission of hydrogen in the laser irradiationprocess. Alternatively, the plasma-enhanced CVD process shown in FIG. 17or a conventional plasma-enhanced CVD process can be employed. In thiscase, a silicon thin film having a low hydrogen atom concentration canbe obtained by adjusting the substrate temperature or the flow rateratio of hydrogen to silane or the flow rate ratio of hydrogen tosilicon tetrafluoride.

(b) The substrate prepared in Step (a) is subjected to a cleaningprocess to remove organic substances, metals, fine particles, surfaceoxide films and other unnecessary matters. The cleaned substrate is thenintroduced into the invented thin film forming system. The substrate isirradiated with a laser beam L0 to convert the silicon thin film to acrystallized silicon thin film T2′. The laser-induced crystallization isperformed in a high purity nitrogen atmosphere of 99.9999% or more at apressure of 700 Torr or more.

(c) After the completion of Step B, the process chamber is evacuated,and the substrate is then transferred via a substrate transfer chamberto a plasma-enhanced CVD chamber. As a first gate insulating film T3, asilicon oxide film is deposited to a thickness of 10 nm at a substratetemperature of 350° C. from material silane, helium, and oxygen gases.Where necessary, the substrate is then subjected to hydrogen plasmatreatment or to heating and annealing. Steps (a) to (c) are conducted inthe invented thin film forming system.

(d) Islands composed of laminated silicon thin film and silicon oxidefilm are then formed. In this step, the etching rate of the siliconoxide film should be preferably higher than that of the silicon thinfilm according to etching conditions. By forming a stepped or taperedpattern section as illustrated in the figure, gate leakage is prevented,and a thin film transistor having a high reliability can be obtained.

(e) The substrate is then cleaned to remove organic substances, metals,fine particles and other impurities, and a second gate insulating filmT4 is formed to cover the above-prepared islands. In this example, asilicon oxide film 30 nm thick is formed by the LPCVD process at 450° C.from material silane and oxygen gases. Alternatively, the process canemploy, for example, the plasma-enhanced CVD process usingtetraethoxysilane (TEOS) and oxygen as materials, the normal pressureCVD process using TEOS and ozone as materials, or the plasma-enhancedCVD process as shown in FIG. 18. Next, an n⁺ silicon film 80 nm thickand a tungsten silicide film 110 nm thick are formed as gate electrodes.The n⁺ silicon film should be preferably a phosphorus-doped crystallinesilicon film formed by the plasma-enhanced CVD process or LPCVD process.The work is then subjected to photolithography and etching processes toyield a patterned gate electrode T5.

(f1, f2) A doping region T6 or T6′ is then formed using the gate as amask. When a complementary metal oxide semiconductor (CMOS) circuit isprepared, an n⁻ channel TFT requiring an n⁺ region, and a p⁻ channel TFTrequiring a p⁺ region are separately formed. The doping techniqueincludes, for example, ion doping where injected dopant ions are notsubjected to mass separation, ion injection, plasma-enhanced doping, andlaser-enhanced doping. According to the application of the product orthe used technique for doping, the surface silicon oxide film isremained as intact or is removed prior to doping (f1, f2).

(g1, g2) An interlayer insulating film T7 or T7′ is deposited, and acontact hole is formed, and a metal is deposited thereon. The work isthen subjected to photolithography and etching to yield a metallicwiring T8. Such interlayer insulating films include, but are not limitedto, a TEOS-based oxide film, a silica coating film, and an organiccoating film that can provide a flat film. The contact hole can beformed by photolithography and etching with a metal. Such metals includelow resistant aluminium, copper, and alloys made from these metals, aswell as tungsten, molybdenum, and other refractory metals. The processincluding these steps can produce a thin film transistor having highperformances and reliability.

FIG. 9 illustrates an embodiment where an alignment mark is previouslyformed and laser irradiation is performed with reference to thealignment mark. FIG. 10 illustrates another embodiment where analignment mark is formed concurrently with laser irradiation. Theseembodiments are based on the TFT manufacture process flow, and arebasically similar to the process shown in FIG. 8. The distinguishablepoints of these embodiments are described below.

In FIG. 9( a), a glass substrate sub0 is cleaned to remove organicsubstances, metals, fine particles, and other undesired matters. On thecleaned substrate, a substrate covering film T1 and a tungsten silicidefilm are sequentially formed. The work is then patterned byphotolithography and etching to form an alignment mark T9 on thesubstrate. A mark protective film T10 is formed to protect the alignmentmark, and a silicon thin film is then formed.

In FIG. 9( b), upon laser light exposure, a target region is exposed tolight with reference to the alignment mark. The alignment in thesuccessive step can be performed with reference to the preformedalignment mark or to an alignment mark formed by crystallized siliconthin film patterning (not shown).

In FIG. 10( b), a crystallized alignment mark T9′ is formed concurrentlywith laser irradiation to the silicon thin film. The crystallizedalignment mark is formed by utilizing a difference in modificationbetween an exposed region and a nonexposed region.

In FIG. 10( d), alignment in the photolithography process is performedby using the crystallized alignment mark T9′. The work is then subjectedto an etching process to form islands composed of laminated silicon thinfilm and silicon oxide film.

The description has thus been made for the embodiment of the opticalsource utilizing the excimer laser such as XeCl, KrF, XeF, ArF or thelike, however, various other kinds of laser such as YAG laser, carbondioxide laser, or the semiconductor laser with the pulse emission can beused. The embodiment is applicable not only to the silicon semiconductorthin film but also to the formation of the crystal thin film and theforming apparatus therefor.

INDUSTRIAL APPLICABILITY

According to the present invention, in the case where the irradiationintensity is increased so as to obtain the crystallized structure of abetter quality, it is possible to prevent the crystal becomingmicrocrystalline or amorphous. Therefore, a technique is provided forforming the silicon thin film with a small trap state density by theenergy beam irradiation such as optical irradiation. A technique is alsoprovided for applying the technique on the substrate with a largesurface and a semiconductor device therefor. A device for manufacturingthe electric field effective transistor utilizing silicon of a goodquality, i.e. with an efficient characteristic can be provided.

In the crystallization utilizing the fine beam which is controlled tothe micron order, a crystal growth length by a single unit pulse hasbeen increased twice as the conventional technique.

1. A thin film processing method of processing a thin film byirradiating an optical beam onto a thin film, wherein: one unit ofirradiation of the optical beam includes irradiations due to first andsecond optical pulses onto the thin film, the thin film is processed byrepeating the one unit of irradiation, each of the first and the secondoptical pulse has different pulse waveforms, the first optical pulse andthe second optical pulse are supplied from respective, separate firstand second optical pulse sources, and said thin film is positioned inposition relative to said first and second optical pulse sources foreach said unit of irradiation, wherein the first and second opticalpulses control a cooling rate to 1.6×10¹⁰° C. or less which prevents thethin film from becoming microcrystalline or amorphous and cansatisfactorily grow the crystal size of the thin film.
 2. A thin filmprocessing method as claimed in claim 1, wherein: the one unit ofirradiation includes the first optical pulse irradiation to the thinfilm and the second optical pulse irradiation to the thin film whichsubstantially starts simultaneously with the irradiation of the firstpulse.
 3. A thin film processing method as claimed in claim 2, wherein:a relationship between the first and the second pulse satisfies that apulse width of the first optical pulse is smaller than a pulse width ofthe second optical pulse and an irradiation intensity of the firstoptical pulse is not lower than an irradiation intensity of the secondoptical pulse.
 4. A thin film processing method as claimed in claim 1,wherein: the one unit of irradiation includes the first optical pulseirradiation to the thin film and the second optical pulse irradiation tothe thin film which substantially starts with a delay to the firstoptical pulse irradiation.
 5. A thin film processing method ofprocessing a thin film by irradiating an optical beam onto a thin film,wherein: one unit of irradiation of the optical beam includesirradiations due to first and second optical pulses onto the thin film,the thin film is processed by repeating the one unit of irradiation, thefirst optical pulse and the second optical pulse are supplied fromrespective, separate first and second optical pulse sources, and saidthin film is positioned in position relative to said first and secondoptical pulse sources for each said unit of irradiation, wherein the oneunit of irradiation includes the first optical pulse irradiation to thethin film and the second optical pulse irradiation to the thin filmwhich substantially starts with a delay to the first optical pulseirradiation, the delay is variable in order to control a cooling rate toa predetermined value, and wherein the first and second optical pulsescontrol the cooling rate to 1.6×10¹⁰° C. or less which prevents the thinfilm from becoming microcrystalline or amorphous and can satisfactorilygrow the crystal size of the thin film.
 6. A thin film processing methodof processing a thin film by irradiating an optical beam onto a thinfilm, wherein: one unit of irradiation of the optical beam includesirradiations due to first and second optical pulses onto the thin film,the thin film is processed by repeating the one unit of irradiation, thefirst optical pulse and the second optical pulse are supplied fromrespective, separate first and second optical pulse sources, and saidthin film is positioned in position relative to said first and secondoptical pulse sources for each said unit of irradiation, wherein the oneunit of irradiation includes the first optical pulse irradiation to thethin film and the second optical pulse irradiation to the thin filmwhich substantially starts simultaneously with the irradiation of thefirst pulse, and wherein the first and second optical pulses control acooling rate to 1.6×10¹⁰° C. or less which prevents the thin film frombecoming microcrystalline or amorphous and can satisfactorily grow thecrystal size of the thin film.
 7. A thin film processing method asclaimed in claim 1, wherein a relationship between the first and secondpulse satisfies: (a pulse width of the first optical pulse)<(a pulsewidth of the second optical pulse).
 8. A thin film processing method asclaimed in claim 7, wherein the relationship between the first and thesecond pulse satisfies (the irradiation intensity of the first opticalpulse)≧(the irradiation intensity of the second optical pulse).